Homogeneous oxidation diffusion furnace (Type I)
Release time: 2020-08-25 16:06:27 Number of views: 3221
Equipment introduction:
Homogeneous temperature oxidation diffusion furnaces are used to diffuse, oxidize, anneal, alloy and sinter wafers in semiconductor devices, discrete devices, optoelectronics, power electronics, solar cells and large-scale integrated circuit manufacturing. They can be used in 2-8 inch process sizes.
Configuration
Equipment features: | |||||||
Outer diameter of process pipe can be configured | Furnace tube outer diameter 152mm suitable for 3 "; Furnace tube outer diameter 252mm suitable for 6 "; | ||||||
Temperature control range | 300~1150 ℃ | ||||||
Length and accuracy of constant temperature zone | 300~1250mm(Subject to customer requirements) 300~800 ℃±1.5℃, 800~1100 ℃±1℃ | ||||||
Controllable rise and fall rate | Heating rate: ≦15℃/min Cooling rate ≦5℃/min | ||||||
quantity of heating zones | 3-zone,4-zone,5-zone,6-zone(customizable) | ||||||
Feeding mode | hand-operated feed | ||||||
cooling system | Water cooling 2-4Kgf/cm2, 8L/min; + upper exhaust air cooling ≈25m3/min; | ||||||
Radial temperature distribution | |||||||
Control system | 1. Sintering process curve setting: dynamic display setting curve, equipment sintering can prestore multiple process curves, each process curve can be set freely; | ||||||
heating chamber | High quality heating wire: KANTHAL and HRE | ||||||
Vacuum sealing system |
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Vacuum degree: ≤10Pa (mechanical pump) | |||||||
Gas supply system | Mass flowmeter is used to control the gas flow rate, which is integrated with the equipment.; | ||||||
Optional item | 1. Discharge port detoxification gas cabinet; | ||||||
Cautions | 1, the sampling piece must be loaded with asbestos gloves, using quartz devices to break carefully; | ||||||
Service | One year limited warranty with lifetime support (warranty does not cover consumable parts such as furnace tubes and seals). |
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